Worldwide Locations
Worldwide locations with six sites in Jiangyin, Chuzhou, Suqian, Singapore and Korea; and two major R&D centers in Singapore and mainland China
Manufacturing Sites
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JCET D1
JCET BU,JCAP-1
Binjiang Road. Jiangyin, Jiangsu
Floor Area:62,321 sqm/GFA:58,300 sqm
Bumping, wafer level pkg and test
Factory Certificate
- ISO9001
- IATF16949
- ISO14001
- OHSAS18001
- QC080000
- SONY GP
- ESD20.20
- IEC17025
- ISO10012
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JCET D3
IC BU, JCAP-2, JSCC,SJsemi
Changshan Road, Jiangyin, Jiangsu
Floor Area:374,882 sqm/GFA:372,500 sqm
WLCSP, Bumping, Flip Chip, Leaded, MIS
Factory Certificate
- ISO9001
- IATF16949
- ISO14001
- QC080000
Factory Certificate
- ISO 9001
- ISO 14001
- IATF 16949
- OHSAS 18001
- SONY GP
- ESD 20.20
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JCET D9
No.999 Century Avenue, Chuzhou, Anhui
Floor Area:169,263 sqm/GFA:85,000 sqm
Leaded, Discrete Package and Test
Factory Certificate
- ISO9001
- IATF16949
- ISO14001
- OHSAS18001
- QC080000
- ESD20.20
- SONY GP
-
JCET D8
No. 5 Purple Mountain Road, Suqian, Jiangsu
Floor Area:84,122 sqm/GFA:53,700 sqm
Power Package and Test
Factory Certificate
- ISO9001
- IATF16949
- ISO14001
- OHSAS18001
- QC080000
- ESD20.20
-
SCS
5 Yishun Street, Singapore
Floor Area:29,894 sqm/GFA:73,600 sqm
Advanced Wafer Level Packaging, Laminate
Factory Certificate
- ISO 9001
- ISO 14001
- IATF 16949
- OHSAS 18001
- Sony GP
- ESD20.20
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SCK/JSCK
191 Jayumuyeok-ro Jung-gu, Incheon, South Korea
Floor Area:110,117 sqm/GFA:110,200 sqm
SiP,Flip Chip, BGA, CSP, Stacked die
Factory Certificate
- ISO 9001
- ISO 14001
- IATF 16949
- OHSAS 18001
- Sony GP
- ISO 14001/JSCK
- ESD20.20
R&D Center
32028102000607
