Grid Array Packaging
Array substrate-based packaging represents
one of the fastest growing areas in the semiconductor packaging industry and is
used in computing platforms, networking, hand-held consumer products, wireless
communications devices, home electronic devices and game consoles, among other
BGA technology was first introduced as a
solution to problems associated with the increasingly high lead counts required
for advanced semiconductors used in applications such as portable consumer
devices and wireless telecommunications. As the number of leads surrounding the
integrated circuits increased, high lead count packages experienced significant
electrical shorting problems. BGA technology solved this problem by effectively
creating and array of leads on the bottom surface of the package in the form of
small bumps or solder balls.
JCET offers a comprehensive range of
laminate-based BGA packaging options:
The Fine Pitch Ball Grid Array package is a laminate substrate-based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. FBGA is also available in stacked configurations (FBGA-SD).
The Fine Pitch Land Grid Array package is a laminate substrate-based package with plastic overmolded encapsulation. Unlike a standard FBGA, second level interconnect is achieved on the LGA by connecting “lands” on the package directly onto the PCB through solder re-flow. FLGA is also available in stacked configurations (FLGA-SD).
The Plastic Ball Grid Array package is a cavity-up laminate substrate-based package in which the die is attached (die up) to the substrate. The wirebonded device and the complete assembly are then overmolded and solder balls attached to form the package. PBGA is available in thermally enhanced (PBGA-H), multi-die (PBGA-MD) and stacked die options (PBGA-SD).
• X Thin BGA
The Extremely Thin Profile Array package’s extra thin design allows a full array of solder balls or lands on the substrate to deliver greater flexibility in input/output (I/O), layout and density in a given package size.
• Advanced Stacked Packages
Multi-die stacking provides a high level of functional integration in well-established package families by stacking die or stacking packages or a mix of both, using a mix of assembly technologies. The types of stacked packages are often characterized by how they are stacked, as chips, packages or passives. In addition to standard stacked packages, STATS ChipPAC offers a range of Package-on-Package (PoP) and Package-in-Package (PiP) configurations.