On 2020 February 8th, JCET Group
Co., Ltd. donated 5 million CNY via the Jiangyin Charity Federation, to support
the prevention of NCP (Novel coronavirus pneumonia）.
The donation included 4 million CNY to support epidemic prevention and control,
patient treatment, material procurement and to help support front-line medical
workers in Hubei Province. An additional 1 million CNY was for Jiangyin
municipal epidemic prevention and control as well as medical supplies. In
addition to the JCET Group donation, the Party Committee and the Labor Union of
JCET are organizing donations with Party members and employees actively
responding and donating.
“Taking responsibility” is one of the core
corporate values of JCET Group Co., Ltd.. Actively participating in the effort
against the epidemic is a part of JCET’s corporate social responsibilities, as
we support and collaborate with the government on various prevention measures.
As JCET Group is a key part of the production supply chain of medical
electronic devices urgently needed in today’s market, we are working hard to
meet the relevant customers’ requirements in priority while strictly executing
the preventative measures and ensuring safety, all in coordination with
government and relevant departments who are providing strong support. The
current production and operation status of JCET Group’s China factories are
stable, and the production and operation of its factories in South Korea and
Singapore have only seen minor affects from the outbreak.
During this special period, JCET will work
together with the community to make contributions to the prevention and control
of the epidemic!
JCET Group is a leading global semiconductor
packaging and test provider, offering a full range of turnkey services that
include semiconductor package design and characterization, R&D, wafer
probe, wafer bumping, package assembly, final test and drop shipment to vendors
around the world. Our comprehensive portfolio covers a wide spectrum of
semiconductor applications including mobile, communication, compute, consumer,
automotive and industry etc., through advanced wafer level packaging, 2.5D/3D,
System-in-Package, flip chip and wire bonding technologies. JCET Group has
three R&D centers, six manufacturing locations in China, Singapore and
Korea, and sales centers around the world providing close technology
collaboration and efficient supply-chain manufacturing to customers in China
and throughout the world. For more details please visit www.jcetglobal.com