FLIP CHIP INTERCONNECT
FLIP CHIP INTERCONNECT


 Backside metalization for high thermal and low cost package
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 Laser Assisted Bonding for Fine Pitch Cost Effective Interconnection
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 Fine Pitch Cu Pillar Assembly Challenges for Advanced Flip Chip Packages [2017] Download
 Fine Pitch High Bandwidth Flip Chip Package-on-Package Development [2017] Download
 Fine Pitch Cu Pillar with BOL Assembly Challenges for Low Cost and High Performance Flip Chip Package [2017] Download
 Large Flip Chip Assembly Challenges and Risk Mitigation Process [2017] Download
 10nm CPI Study for Fine Pitch Flip Chip Attach Process and Substrate [2017] Download
 Advanced Packaging for Automotive Dashboard Application [2017] Download
 Ultra-Thin Substrate Assembly Challenges for Advanced Flip Chip Package [2016] Download
 Thin Profile Flip Chip Package-on-Package Development [2016] Download
 Fine Pitch Cu Pillar with BOL Assembly Challenges for High Performance Flip Chip Package [2016] Download
 Advanced Flip Chip Package on Package [2016] Download
 Design and Stress Analysis for Fine Pitch Flip Chip Packages with Cu Column Interconnects [2014] Download
 Optimization of Compression Bonding Processing Temp for Fine Pitch Cu Col Flip Chip Devices [2014] Download
 Electromigration for Advanced Cu Interconnect and the Challenges with Reduced Pitch Bumps [2014] Download


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