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2023-10-10
JCET Pioneering High-Reliability SiC Device Packaging for Automotive Applications
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2023-09-19
JCET Boosts Medium and High Power Device Manufacturing, Focusing on Wide Bandgap Products
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2023-08-25
Focusing on High-performance Advanced Packaging and Global Layout, JCET Achieved Quarter-on-Quarter Growth in Q2 2023
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2023-07-18
JCET's Package Solution for In-Vehicle Class D Audio Amplifier ICs Contributes to Better Experiences for Consumers
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2023-06-21
JCET’s New High-end Manufacturing Facility in Jiangyin Completes Roof Sealing Stage on Schedule
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2023-06-19
JCET's High-density Heterogeneous Integration SiP Solution for 5G RF PA to Begin HVM
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2023-04-27
JCET Recognized for Excellence by Texas Instruments for 2022
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2023-04-25
JCET Will Continuously Focus on R&D and Resource Investment, Preparing for Future Market Growth
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