• Technology & Solutions
    • Turnkey Services
    • Design
    • Packaging
      • Wirebond Packaging
      • Flip Chip Packaging
      • Wafer Bumping
      • Wafer Level Packaging
      • System-in-Package
      • MEMS and Sensors Packaging
      • Power Device Packaging
      • Advancement of Mainstream Package
    • Test
  • Applications
    • Automotive
    • Computing
    • Storage
    • Smart Terminals
    • Power & Energy
  • About JCET
    • Company Information
    • Worldwide Locations
    • Corporate Culture
    • Leadership Team
    • Environmental Social & Governance
    • Conflict-Free Minerals Policy
    • Contact Us
  • Investor Relations
    • Financial Reports
News
English 中文
  • Home
  • Technical Solutions
    Turnkey Design Packaging
    Wirebond Packaging Flip Chip Packaging Wafer Bumping Wafer Level Packaging System-in-Package MEMS and Sensors Packaging Power Device Packaging Advancement of Mainstream Package
    Test Others
    晶圆凸块 可靠性试验与失效分析
  • Application fields
    Automotive Computing Storage Smart Terminals Power & Energy
  • About JCET
    Company Information Worldwide Locations Corporate Culture Leadership Team Management Team Environmental, Social & Governance Contact Us
  • Investor Relations
    Financial Reports
  • News
  • Join JCET
  •   
    English 中文
Homepage NEWS
News
NEWS
2023
All 2025 2024 2023 2022 2021 before
All Company News ESG News Finance
Company News
2023-12-28
Share, Trust, and Prosper: JCET Hosts the 2023 Global Supplier Day
Company News
2023-12-27
Immersive Semiconductor Packaging and Test Museum Opens in Jiangyin
Company News
2023-12-01
JCET Collaborates with Well-Known Industry Clients to Develop High-Standard UWB Products for Enhanced Automotive Safety
Company News
2023-11-17
JCET's High-precision Millimeter-wave Radar Advanced Packaging Solution Meets Diverse Customer Needs
Company News
2023-11-03
JCET’s Automotive Chip Back-end Manufacturing Base: Establishing an Intelligent and Lean Lighthouse Factory
Finance
2023-11-01
JCET to Build an Automotive Chip Advanced Packaging Flagship Factory in China
  • 1
  • 2
  • 3
  • 4
  • Technology & solutions Turnkey Services Design Packaging Test
  • Applications Automotive Computing Storage Smart Terminals Power & Energy
  • About JCET Company Introduction Worldwide Locations Corporate Culture Leadership Team Environmental Social & Governance Conflict-Free Minerals Policy Contact Us
  • Investor Relations Financial Reports
  • News
  • Careers
  • Legal Notices
版权所有@江苏长电科技股份有限公司 保留一切权利 苏ICP备05082751号-1 32028102000607
Share: