JCET Releases Q3 2022 Report

High-Performance Packaging Technology Opens

New Opportunities for Semiconductor Back-end Manufacturing

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Our Mission

To provide advanced and reliable integrated
circuit back-end manufacturing technology
and services for a smarter world

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Turnkey IC Manufacturing
Solutions

JCET provides one-step IC back-end
manufacturing services

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Founded in 1972, JCET Group is the world's leading integrated circuit manufacturing and technology services provider. JCET is a global company that serves the world through our rich technology patent portfolio, our six-site manufacturing powerhouse, and our dedicated teams around the globe.

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2.5/3D Integration

Innovative 2.5D/3D integration technologies in WLP, FC and TSV areas

Wafer Level & Fan Out Packaging

Industry leading platform of wafer level solutions, including FI/FOWLP, IPD, TSV, ECP, and RFID

System-in-Package

Advanced SiP technologies including laser assisted bonding and EMI shielding

Flip Chip Packaging

Broad Flip Chip portfolio from large single die packages to modules and advanced 3D packaging

Wirebond Packaging

Support of gold, silver, and copper based wirebond to realize cost-effective and flexible solutions

MEMS and Sensors Packaging

Innovative integration solutions to achieve size, performance and cost requirements

Turnkey Services

 

JCET delivers world-class services to its customers. The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider – including IC design and characterization, wafer bumping, packaging, test, and shipment to end customers.

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